10L Tablet computer mainboard
Whilst the manufacturing process may be slightly more complex, the product you are left with can be used in a range of products across various industries. HDI PCBs are used in advanced technology systems such as smartphones and games consoles. They are also making a huge impact on the medical industries as their small size means they can fit in devices such as imaging equipment for miniature sized cameras, which help doctors in their patient diagnosis, without impacting the picture quality.
HDI PCBs have become popular due to their small size, high quality and versatility. With HDI design, ABL Circuits can help design and manufacture the perfect board for your next product. Get in touch for the team for more information on these innovative boards.
1 . Descriptions:
What is a HDI PCB?
HDI stands for High Density Interconnector. A circuit board which has a higher wiring density per unit area as opposed to conventional board is called as HDI PCB. HDI PCBs have finer spaces and lines, minor vias and capture pads and higher connection pad density. It is helpful in enhancing electrical performance and reduction in weight and size of the equipment. HDI PCB is the better option for high-layer count and costly laminated boards.
Regarding the electrical needs of high-speed signal, the board should have various features i.e. high-frequency transmission capability, impedance control, decreases redundant radiation, etc. The board should be enhanced in the density because of the miniaturization and arrays of the electronic parts. In addition, to the result of the assembling techniques of leadless, fine pitch package and direct chip bonding, the board is even featured with exceptional high-density.
Innumerable benefits are associated with HDI PCB, like high speed, small size and high frequency. It is the primary part of portable computers, personal computers, and mobile phones. Currently, HDI PCB is extensively used in other end user products i.e. as MP3 players and game consoles, etc.
2 . Specifications:
| Name | 10L Tablet computer mainboard |
| Number of Layers | 10 |
| Quality Grade | IPC 6012 Class 2,IPC 6012 Class 3 |
| Material | EM370 |
| Thickness | 0.7mm |
| Min Track/Spacing | 50um/60um |
| Min Hole Size | Laser 75um; Drilling size 200um |
| Solder Mask | Green |
| Silkscreen | White |
| Surface Finish | Immersion gold,OSP |
| Finished Copper | 12um |
| Production time | 10-21 working days |
| Lead time | 2-3 days |
3. Advantages:
The most common reason for using HDI technology is a significant increase in packaging density. The space obtained by finer track structures is available for components. Besides, overall space requirements are reduced will result in smaller board sizes and fewer layers.
Usually FPGA or BGA are available with 1mm or less spacing. HDI technology makes routing and connection easy, especially when routing between pins.
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